Multi-camera system using folded optics

ABSTRACT

Described herein are methods and devices that employ a plurality of image sensors to capture a target image of a scene. As described, positioning at least one reflective or refractive surface near the plurality of image sensors enables the sensors to capture together an image of wider field of view and longer focal length than any sensor could capture individually by using the reflective or refractive surface to guide a portion of the image scene to each sensor. The different portions of the scene captured by the sensors may overlap, and may be aligned and cropped to generate the target image.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims the benefit of U.S. Patent ApplicationNo. 61/716,339 filed Oct. 19, 2012, entitled “MULTI-CAMERA SYSTEM USINGFOLDED OPTICS” and assigned to the assignee hereof. The disclosure ofthis prior application is considered part of, and is incorporated byreference in, this disclosure.

TECHNICAL FIELD

The present disclosure relates to imaging systems and methods thatinclude a multi-camera array. In particular, the disclosure relates tosystems and methods that enable low-profile imaging systems and mobiledevices while maintaining or improving image quality.

BACKGROUND

Many mobile devices, such as mobile phones and tablet computing devices,include cameras that may be operated by a user to capture still and/orvideo images. Because the mobile devices are typically designed to berelatively small, it can be important to design the cameras or imagingsystems to be as thin as possible in order to maintain a low-profilemobile device. In various conventional devices, the thickness of themobile device is maintained as small as possible by turning the imagingsensor on its side and using reflective devices to bend the rays to thesensor. However, this particular solution is not very robust because thewidth of the imaging sensor and the pixel pitch may determine thehighest resolution of the camera.

In other conventional devices, the thickness of the mobile device ismaintained as small as possible by shortening the focal length of theimaging system. However, various problems can arise when the focallength of the system is designed to be as short as possible. Forexample, because the focal length and the field of view of the systemare inversely related, shortening the focal length may increase thefield of view to such an extent that the image may cross over from anatural image to an unnatural wide field of view image, e.g., at fieldsof view of about 60 degrees or greater. Furthermore, lens roll-off,e.g., the loss of light or brightness near the edges of an image ascompared with the center of an image, may increase as focal lengthdecreases. Thus, as the focal length of imaging systems in mobiledevices is reduced, image quality may degrade due to undesirable lensroll-off.

In addition, the modulation transfer function (MTF) of imaging systemsin various mobile devices may produce lower resolution near the edges ofthe image as compared to the center of the image, which may be referredto as MTF roll-off. Because MTF roll-off may also be inversely relatedto focal length, a reduced focal length in mobile devices may reduce theresolution at the edges of the image. Moreover, shorter focal lengthsmay increase the angle of incidence of the lens' chief ray, which canalso generate undesirable artifacts, including increased light andelectrical crosstalk between pixels and a lower sensor MTF performance.Accordingly, it can be advantageous to reduce the thickness of imagingsystems in mobile devices, while maintaining or improving image quality.

SUMMARY

The folded optic sensor arrays and image capture techniques describedherein allow for the creation of low-profile image capture deviceswithout shortening the focal length or decreasing the resolution of theimage across the sensor array's field of view. By redirecting lighttoward each sensor in the array using a primary and secondary surface,and by positioning the lens assemblies used to focus the incoming lightbetween the primary and secondary surfaces, the sensor array may bepositioned on a flat substrate perpendicular to the lens assemblies. Thelonger focal length makes it possible to implement features such asoptical zoom and to incorporate more complicated optics that requiremore space than commonly afforded by the traditional mobile camera, suchas adding more optical elements. Camera acuity, which refers to thecamera's angular resolution and it defines how well the camera resolvesfar away objects, is proportional to focal length and thus directlybenefits from longer cameras.

Some of the embodiments may employ a central mirror, for example withmultiple surfaces, to split incoming light comprising the target imageinto multiple portions for capture by the sensors in the array. Otherembodiments may employ a prism with multiple facets, wherein each facetdirects a portion of the light comprising the target image toward asensor in the array. Each portion of the split light may be passedthrough a lens assembly and reflected off of a surface positioneddirectly above or below a sensor, such that each sensor captures aportion of the image. In some circumstances, each sensor in the arraymay capture a portion of the image which overlaps slightly with theportions captured by neighboring sensors in the array, and theseportions may be assembled into the target image, for example by imagestitching techniques.

According to one embodiment, an image capture system comprises aplurality of image sensors, each of the plurality of image sensorshaving one of a plurality of fields of view, each of the plurality offields of view comprising a substantially different portion of thescene; a plurality of lens assemblies, each lens assembly correspondingto one of the plurality of image sensors; a primary surface positionedso as to direct light comprising at least a portion of the scene throughat least one of the plurality of lens assemblies; a plurality ofsecondary surfaces, wherein each of the secondary surfaces directs atleast a portion of the light from one of the plurality of lensassemblies into one of the plurality of image sensors, and wherein eachof the plurality of image sensors captures one of a plurality of partialimages, each of the plurality of partial images corresponding to one ofthe plurality of fields of view; and a processing module configured toassemble the plurality of partial images into the target image.

The image capture system may further comprise a substantially flatsubstrate. The plurality of image sensors, plurality of lens assemblies,primary surface and secondary surfaces may be mounted on the substratein a variety of suitable configurations. The primary surface maycomprise one or more reflective surface, and in some embodiments may bea prism comprising one or more facets configured to redirect incominglight comprising the target image scene.

According to another embodiment, a method is provided for capturing atarget image scene, the method comprising the steps of providingplurality of image sensors, each of the plurality of image sensorshaving one of a plurality of fields of view, each of the plurality offields of view comprising a substantially different portion of thescene; providing a plurality of lens assemblies, each lens assemblycorresponding to one of the plurality of image sensors; directing lightcomprising at least a portion of the scene toward each of the pluralityof lens assemblies using at least one primary surface; directing thelight from each of the plurality of lens assemblies toward acorresponding one of the plurality of image sensors using a plurality ofsecondary surfaces; capturing a plurality of partial images, whereineach of the plurality of partial images is captured by one of theplurality of image sensors and corresponds to one of the plurality offields of view; and assembling the plurality of partial images into thetarget image.

BRIEF DESCRIPTION OF THE DRAWINGS

Various aspects of image capture are illustrated by way of example, andnot by way of limitation, in the accompanying drawings, wherein:

FIG. 1A illustrates a cross-sectional side view of an embodiment of afolded optic sensor assembly;

FIG. 1B illustrates an top view of an embodiment of projected fields ofview of the folded optic sensor assembly of FIG. 1A;

FIG. 2 illustrates a block diagram of one embodiment of an image capturedevice;

FIG. 3A illustrates a block diagram of an embodiment of a folded opticsensor array;

FIG. 3B illustrates perspective view of an embodiment of the foldedoptic sensor array of FIG. 3A;

FIG. 3C illustrates an schematic diagram of one embodiment of projectedfields of view of the folded optic sensor array of FIGS. 3A-B;

FIG. 4 illustrates a cross-sectional side view of one embodiment of afolded optic sensor assembly showing the angular relationship of itscomponents;

FIG. 5A illustrates a perspective view of another embodiment of a foldedoptic sensor array;

FIG. 5B illustrates a perspective view of yet another embodiment of afolded optic sensor array;

FIG. 5C illustrates a schematic diagram of an embodiment of projectedfields of view of the folded optic sensor arrays of FIGS. 5A-B;

FIG. 6A illustrates a perspective view of another embodiment of a foldedoptic sensor array;

FIG. 6B illustrates a schematic diagram of an embodiment of projectedfields of view of the folded optic sensor array of FIG. 6A;

FIG. 7 illustrates a block diagram of an embodiment of a cascaded foldedoptic sensor array;

FIG. 8 illustrates a cross-sectional side view of another embodiment ofa folded optic sensor assembly; and

FIG. 9 illustrates an embodiment of a folded optic image captureprocess.

DETAILED DESCRIPTION

Implementations disclosed herein provide systems, methods and apparatusfor mobile imaging applications. For example, as explained herein, itcan be desirable to reduce the form factor of mobile devices whilemaintaining or improving image quality. The implementations disclosedherein can be used in mobile devices to reduce the thickness of imagingsystems by employing multiple imaging sensors and/or multiple lensesacross the field of view of the imaging system. In variousimplementations, an array of cameras and/or imaging sensors may beprovided adjacent one or more reflective surfaces. The array of sensorscan capture multiple, overlapping images, which can be stitched togetherto form a single image while maintaining high image quality andresolution. By spacing multiple sensors laterally on a substrate, orotherwise adjacent one another in the system, the overall height orthickness of the imaging system can be reduced. In variousimplementations, the disclosed systems may be so-called folded opticalsystems that include relatively long optical path lengths. By notreducing the focal length in a substantial way, the reductions in imagequality described above can be avoided, while still maintaining animaging system with a reduced height.

It should be appreciated that many other implementations of thedisclosed concepts are possible. Various advantages can be achieved withthe disclosed implementations. For example, the overall thickness of themobile device, including the imaging system, can be reduced comparedwith conventional imaging systems used in mobile devices. Further, theresolution of the image across the sensor array's field of view can beimproved and can avoid the roll-off in resolution found in traditionalcameras (e.g., where resolution may decrease at the edges). Further, theuse of multiple lenses across the field of view of the system canincrease the total effective resolution across the entire field of view.In addition, the use of multiple lenses may increase the focal length ofthe camera and thus increase the camera's acuity.

In various arrangements, the field of view of each camera may overlap toachieve specific purposes, such as enabling the ability to adjust thefocus after post-processing. Furthermore, high dynamic range cameras canbe implemented to capture two simultaneous images and then merge themtogether. In addition, an autofocus application can be implemented bychanging the focal length between the lens and the sensor of each camerain the array. As explained herein, various other advantages andimplementations can be achieved.

One skilled in the art will recognize that these embodiments may beimplemented in hardware, software, firmware, or any combination thereof.Those of skill in the art will understand that information and signalsmay be represented using any of a variety of different technologies andtechniques. For example, data, instructions, commands, information,signals, bits, symbols, and chips that may be referenced throughout theabove description may be represented by voltages, currents,electromagnetic waves, magnetic fields or particles, optical fields orparticles, or any combination thereof.

In the following description, specific details are given to provide athorough understanding of the examples. However, it will be understoodby one of ordinary skill in the art that the examples may be practicedwithout these specific details. For example, electricalcomponents/devices may be shown in block diagrams in order not toobscure the examples in unnecessary detail. In other instances, suchcomponents, other structures and techniques may be shown in detail tofurther explain the examples.

It is also noted that the examples may be described as a process, whichis depicted as a flowchart, a flow diagram, a finite state diagram, astructure diagram, or a block diagram. Although a flowchart may describethe operations as a sequential process, many of the operations can beperformed in parallel, or concurrently, and the process can be repeated.In addition, the order of the operations may be re-arranged. A processis terminated when its operations are completed. A process maycorrespond to a method, a function, a procedure, a subroutine, asubprogram, etc. When a process corresponds to a software function, itstermination corresponds to a return of the function to the callingfunction or the main function.

Referring now to FIGS. 1A-B, an exemplary folded optics multi-sensorassembly 100 will now be described in greater detail. As show in FIG.1A, a sensor assembly 100 may include image sensors 105, 125, reflectivesurfaces 110, 135, lens assemblies 115, 130, a central reflectivesurface 120 all mounted to a substrate 150.

The image sensors 105, 125 may comprise, in certain embodiments, acharge-coupled device (CCD), complementary metal oxide semiconductorsensor (CMOS), or any other image sensing device that receives light andgenerates image data in response to the received image. Image sensors105, 125 may be able to obtain image data of still photographs and mayalso provide information regarding motion in a captured video stream.Sensors 105 and 125 may be individual sensors or may represent arrays ofsensors, such as a 3×1 array. However, as will be understood by oneskilled in the art, any suitable array of sensors may be used in thedisclosed implementations.

The sensors 105, 125 may be mounted on the substrate 150 as shown inFIG. 1A. In some embodiments, all sensors may be on one plane by beingmounted to the flat substrate 150. Substrate 150 may be any suitablesubstantially flat material. The central reflective surface 120 and lensassemblies 115, 130 may be mounted on the substrate 150 as well.Multiple configurations are possible for mounting a sensor array orarrays, a plurality of lens assemblies, and a plurality of primary andsecondary reflective or refractive surfaces.

In some embodiments, a central reflective surface 120 may be used toredirect light from a target image scene toward the sensors 105, 125.Central reflective surface 120 may be a mirror or a plurality ofmirrors, and may be flat or shaped as needed to properly redirectincoming light to the image sensors 105, 125. For example, in someembodiments, central reflective surface 120 may be a mirror sized andshaped to reflect incoming light rays through the lens assemblies 115,130 to sensors 105, 125. The central reflective surface 120 may splitlight comprising the target image into multiple portions and direct eachportion at a different sensor. For example, a first side 122 of thecentral reflective surface 120 may send a portion of the lightcorresponding to a first field of view 140 toward the left sensor 105while a second side 124 sends a second portion of the lightcorresponding to a second field of view 145 toward the right sensor 125.It should be appreciated that together the fields of view 140, 145 ofthe image sensors cover at least the target image.

In some embodiments in which the receiving sensors are each an array ofa plurality of sensors, the central reflective surface may be made ofmultiple reflective surfaces angled relative to one another in order tosend a different portion of the target image scene toward each of thesensors. Each sensor in the array may have a substantially differentfield of view, and in some embodiments the fields of view may overlap.Certain embodiments of the central reflective surface may havecomplicated non-planar surfaces to increase the degrees of freedom whendesigning the lens system. Further, although the central surface isdiscussed as being a reflective surface, in other embodiments centralsurface may be refractive. For example, central surface may be a prismconfigured with a plurality of facets, where each facet directs aportion of the light comprising the scene toward one of the sensors.

After being reflected off the central reflective surface 120, the lightmay be passed through lens assemblies 115, 130. One or more lensassemblies 115, 130 may be provided between the central reflectivesurface 120 and the sensors 105, 125 and reflective surfaces 110, 135.The lens assemblies 115, 130 may be used to focus the portion of thetarget image which is directed toward each sensor.

In some embodiments, each lens assembly may comprise one or more lensesand an actuator for moving the lens among a plurality of different lenspositions through a housing. The actuator may be a voice coil motor(VCM), micro-electronic mechanical system (MEMS), or a shape memoryalloy (SMA). The lens assembly may further comprise a lens driver forcontrolling the actuator.

Traditional auto focus techniques may be implemented by changing thefocal length between the lens 115, 130 and corresponding sensor 105, 125of each sensor assembly. In some embodiments, this may be accomplishedby moving a lens barrel. Other embodiments may adjust the focus bymoving the central mirror up or down or by adjusting the angle of themirror relative to the lens assembly. Certain embodiments may adjust thefocus by moving the side mirrors over each sensor. Such embodiments mayallow the assembly to adjust the focus of each sensor individually.Further, it is possible for some embodiments to change the focus of theentire assembly at once, for example by placing a lens like a liquidlens over the entire assembly. In certain implementations, computationalphotography may be used to change the focal point of the camera array.

Multiple side reflective surfaces, such as reflective surfaces 110 and135, can be provided around the central mirror 120 opposite the sensors.After passing through the lens assemblies, the side reflective surfaces110, 135 can reflect the light downward onto the flat sensors 105, 125.As depicted, sensor 105 may be positioned beneath reflective surface 110and sensor 125 may be positioned beneath reflective surface 135.However, in other embodiments, the sensors may be above the sidereflected surfaces, and the side reflective surfaces may be configuredto reflect light upward. Other suitable configurations of the sidereflective surfaces and the sensors are possible in which the light fromeach lens assembly is redirected toward the sensors. Certain embodimentsmay enable movement of the side reflective surfaces 110, 135 to changethe focus or field of view of the associated sensor.

As shown in FIG. 1B, each sensor's field of view 140, 145 may be steeredinto the object space by the surface of the central mirror 120associated with that sensor. Mechanical methods may be employed to tiltthe mirrors and/or move the prisms in the array so that the field ofview of each camera can be steered to different locations on the objectfield. This may be used, for example, to implement a high dynamic rangecamera, to increase the resolution of the camera system, or to implementa plenoptics camera system. Each sensor's (or each 3×1 array's) field ofview may be projected into the object space, and each sensor may capturea partial image comprising a portion of the target scene according tothat sensor's field of view. In some embodiments, the fields of view140, 145 for the opposing sensor arrays 105, 125 may overlap by acertain amount 150. To reduce the overlap 150 and form a single image, astitching process as described below may be used to combine the imagesfrom the two opposing sensor arrays 105, 125. Certain embodiments of thestitching process may employ the overlap 150 for identifying commonfeatures in stitching the partial images together. After stitching theoverlapping images together, the stitched image may be cropped to adesired aspect ratio, for example 4:3 or 1:1, to form the final image.

FIG. 2 depicts a high-level block diagram of a device 200 having a setof components including an image processor 220 linked to one or moreimage sensor assemblies 215 a-n. The image processor 220 is also incommunication with a working memory 205, memory 230, and deviceprocessor 250, which in turn is in communication with storage 210 andelectronic display 225.

Device 200 may be a cell phone, digital camera, tablet computer,personal digital assistant, or the like. There are many portablecomputing devices in which a reduced thickness imaging system such as isdescribed herein would provide advantages. Device 200 may also be astationary computing device or any device in which a thin imaging systemwould be advantageous. A plurality of applications may be available tothe user on device 200. These applications may include traditionalphotographic and video applications, high dynamic range imaging,panoramic photo and video, or stereoscopic imaging such as 3D images or3D video.

The image capture device 200 includes the image sensor assemblies 215a-n for capturing external images. The image sensor assemblies 215 a-nmay each comprise a sensor, lens assembly, and a primary and secondaryreflective or refractive surface for redirecting a portion of a targetimage to each sensor, as discussed above with respect to FIG. 1A. Ingeneral, N image sensor assemblies 215 a-n may be used, where N≧2. Thus,the target image may be split into N portions in which each sensor ofthe N sensor assemblies captures one portion of the target imageaccording to that sensor's field of view. However, some embodiments mayemploy only one image sensor assembly, and it will be understood thatimage sensor assemblies 215 a-n may comprise any number of image sensorassemblies suitable for an implementation of the folded optic imagingdevice described herein. The number of sensors may be increased toachieve lower z-heights of the system, as discussed in more detail belowwith respect to FIG. 4, or to meet the needs of other purposes, such ashaving overlapping fields of view similar to that of a plenopticscamera, which may enable the ability to adjust the focus of the imageafter post-processing. Other embodiments may have a field of viewoverlap configuration suitable for high dynamic range cameras enablingthe ability to capture two simultaneous images and then merge themtogether. The image sensor assemblies 215 a-n may be coupled to thecamera processor 220 to transmit captured image to the image processor220.

The image processor 220 may be configured to perform various processingoperations on received image data comprising N portions of the targetimage in order to output a high quality stitched image, as will bedescribed in more detail below. Processor 220 may be a general purposeprocessing unit or a processor specially designed for imagingapplications. Examples of image processing operations include cropping,scaling (e.g., to a different resolution), image stitching, image formatconversion, color interpolation, color processing, image filtering(e.g., spatial image filtering), lens artifact or defect correction,etc. Processor 220 may, in some embodiments, comprise a plurality ofprocessors. Certain embodiments may have a processor dedicated to eachimage sensor. Processor 220 may be one or more dedicated image signalprocessors (ISPs) or a software implementation of a processor.

As shown, the image processor 220 is connected to a memory 230 and aworking memory 205. In the illustrated embodiment, the memory 230 storescapture control module 235, image stitching module 240, and operatingsystem 245. These modules include instructions that configure the imageprocessor 220 of device processor 250 to perform various imageprocessing and device management tasks. Working memory 205 may be usedby image processor 220 to store a working set of processor instructionscontained in the modules of memory 230. Alternatively, working memory205 may also be used by image processor 220 to store dynamic datacreated during the operation of device 200.

As mentioned above, the image processor 220 is configured by severalmodules stored in the memories. The capture control module 235 mayinclude instructions that configure the image processor 220 to adjustthe focus position of imaging sensor assemblies 215 a-n. Capture controlmodule 235 may further include instructions that control the overallimage capture functions of the device 200. For example, capture controlmodule 235 may include instructions that call subroutines to configurethe image processor 220 to capture raw image data of a target imagescene using the imaging sensor assemblies 215 a-n. Capture controlmodule 235 may then call the image stitching module 240 to perform astitching technique on the N partial images captured by the sensorassemblies 215 a-n and output a stitched and cropped target image toimaging processor 220. Capture control module 235 may also call theimage stitching module 240 to perform a stitching operation on raw imagedata in order to output a preview image of a scene to be captured, andto update the preview image at certain time intervals or when the scenein the raw image data changes.

Image stitching module 240 may comprise instructions that configure theimage processor 220 to perform stitching and cropping techniques oncaptured image data. For example, each of the N sensors 215 a-n maycapture a partial image comprising a portion of the target imageaccording to each sensor's field of view. The fields of view may shareareas of overlap, as described above with respect to FIG. 1B and belowwith respect to FIGS. 3C, 4C, 5B and 6B. In order to output a singletarget image, image stitching module 240 may configure the imageprocessor 220 to combine the multiple N partial images to produce ahigh-resolution target image. Target image generation may occur throughknown image stitching techniques. Examples of image stitching can befound in U.S. patent application Ser. No. 11/623,050 which is herebyincorporated by reference in its entirety.

For instance, image stitching module 240 may include instructions tocompare the areas of overlap along the edges of the N partial images formatching features in order to determine rotation and alignment of the Npartial images relative to one another. Due to rotation of partialimages and/or the shape of the field of view of each sensor, thecombined image may form an irregular shape. Therefore, after aligningand combining the N partial images, the image stitching module 240 maycall subroutines which configure image processor 220 to crop thecombined image to a desired shape and aspect ratio, for example a 4:3rectangle or 1:1 square. The cropped image may be sent to the deviceprocessor 250 for display on the display 225 or for saving in thestorage 210.

Operating system module 245 configures the image processor 220 to managethe working memory 205 and the processing resources of device 200. Forexample, operating system module 245 may include device drivers tomanage hardware resources such as the imaging sensor assemblies 215 a-n.Therefore, in some embodiments, instructions contained in the imageprocessing modules discussed above may not interact with these hardwareresources directly, but instead interact through standard subroutines orAPIs located in operating system component 270. Instructions withinoperating system 245 may then interact directly with these hardwarecomponents. Operating system module 245 may further configure the imageprocessor 220 to share information with device processor 250.

Device processor 250 may be configured to control the display 225 todisplay the captured image, or a preview of the captured image, to auser. The display 225 may be external to the imaging device 200 or maybe part of the imaging device 200. The display 225 may also beconfigured to provide a view finder displaying a preview image for a useprior to capturing an image, or may be configured to display a capturedimage stored in memory or recently captured by the user. The display 225may comprise an LCD or LED screen, and may implement touch sensitivetechnologies.

Device processor 250 may write data to storage module 210, for exampledata representing captured images. While storage module 210 isrepresented graphically as a traditional disk device, those with skillin the art would understand that the storage module 210 may beconfigured as any storage media device. For example, the storage module210 may include a disk drive, such as a floppy disk drive, hard diskdrive, optical disk drive or magneto-optical disk drive, or a solidstate memory such as a FLASH memory, RAM, ROM, and/or EEPROM. Thestorage module 210 can also include multiple memory units, and any oneof the memory units may be configured to be within the image capturedevice 200, or may be external to the image capture device 200. Forexample, the storage module 210 may include a ROM memory containingsystem program instructions stored within the image capture device 200.The storage module 210 may also include memory cards or high speedmemories configured to store captured images which may be removable fromthe camera.

Although FIG. 2 depicts a device having separate components to include aprocessor, imaging sensor, and memory, one skilled in the art wouldrecognize that these separate components may be combined in a variety ofways to achieve particular design objectives. For example, in analternative embodiment, the memory components may be combined withprocessor components to save cost and improve performance.

Additionally, although FIG. 2 illustrates two memory components,including memory component 230 comprising several modules and a separatememory 205 comprising a working memory, one with skill in the art wouldrecognize several embodiments utilizing different memory architectures.For example, a design may utilize ROM or static RAM memory for thestorage of processor instructions implementing the modules contained inmemory 230. The processor instructions may be loaded into RAM tofacilitate execution by the image processor 220. For example, workingmemory 205 may comprise RAM memory, with instructions loaded intoworking memory 205 before execution by the processor 220.

Turning to FIGS. 3A-C, one embodiment of a folded optic sensor array 300will be described in more detail. The array 300 comprises two 3×1 rowsof sensor assemblies and a central light redirection surface 335, forexample a mirror. As shown in FIG. 1A, sensor assemblies A-F may eachinclude an image sensor, a lens assembly, and a secondary reflectivesurface. Some embodiments of the sensor array 300 configuration may havea field of view of 82 degrees.

As illustrated in FIGS. 3A and 3B, sensor assembly A 305, sensorassembly B 310, and sensor assembly C 315 are aligned parallel to oneanother adjacent along a first axis 301 on one side 337 of the centralmirror 335. Sensor assembly D 320, sensor assembly E 325, and sensorassembly F 330 are aligned parallel to one another adjacent along asecond axis 302 on the opposite side 338 of central mirror 335. Thefirst and second axis are aligned parallel to a central line of symmetry336 of central mirror 335. Although as depicted there is a uniform gapbetween each sensor assembly on an axis, the amount of this gap isvariable, and some embodiments may arrange the sensors with no gapbetween them, for example by cutting the sensors as a group from asilicon wafer.

FIG. 3B illustrates a perspective view of the central mirror 335displaying three distinct mirrored surfaces 337, 338 and 339. Mirroredsurface 337 redirects light comprising a portion of the target imagetoward sensor assembly 320. This portion of the target image correspondsto the field of view of sensor 320. Mirrored surface 338 redirectsanother portion of the target image toward sensor assembly 325, andmirrored surface 339 redirects a third portion of the target imagetoward sensor assembly 330. Although not shown in the view illustratedby FIG. 3B, the opposite side of the central mirror comprises threesimilar surfaces reflecting light toward sensor assemblies 305, 310, and315.

The fields of view of each of the sensors in the array 300 areillustrated in FIG. 3C. Field of view 360 corresponds to sensor 320,field of view 365 corresponds to sensor 325, and field of view 370corresponds to sensor 330. Due in part to the relative angle of centralmirror surfaces 337 and 338, fields of view 360 and 365 share atriangular overlap. Fields of view 365 and 370 may also share atriangular overlap of the same specifications. As the central mirror 335is symmetrical about line of symmetry 336, fields of view 345, 350, and355 may bear a similar relationship to one another as fields of view360, 365 and 370. Further, the two rows of the sensor array may shareoverlapping fields of view. Fields of view 365 and 350 share arectangular overlap. In some embodiments, the sensors in the array maycapture a plurality of images according to the illustrated fields ofview, and the plurality of images may be stitched together and croppedto the rectangular boundary 340 in order to produce the target image.

FIG. 4 illustrates one embodiment of a folded optic sensor assembly 400comprising a sensor 405, a lens system 495, a first reflective surface480 and a second reflective surface 401.

In the folded optic sensor assembly 400, the first reflective surface480 may be positioned at an angle τ_(o) relative to the plane on whichsensor 405 is mounted. The second reflective surface 401 may bepositioned at an angle τ_(i) relative to the plane on which sensor 405is mounted. The sensor 405 may have a diagonal field of view γ and afield of view of the height of the sensor γ_(H) determined at least inpart by sensor height 410. The lens system 495 may be positioned adistance 445 from first reflective surface 480, measured along a centralaxis from point d_(o) on the receiving edge of lens system 495 to pointQ_(o) on reflective surface 480. The lens system may be positioned adistance 430 from second reflective surface 401, measured along acentral axis from point d_(i) on the light transmitting edge of lenssystem 495 to point Q_(i) on reflective surface 401.

Incident light 475 comprising the target image scene travels towardfirst reflective surface 480. The incident beam 475 hits the surface 480at point P_(o) and then is reflected off of the surface 480 and travelsas reflected beam 470 toward the lens system 495. Incident beam 475forms an angle α_(o) relative to the receiving edge of lens system 495,and reflected beam 470 forms an angle β_(o) relative to the receivingedge of lens system 495. The angle of reflection between incident beam475 and reflected beam 470 is denoted by variable δ_(o).

The reflected beam 470 then enters lens system 495 and passes through atleast one lens of diameter 465. The lens system 495 has a length 435 anddiameter 425. Within the lens system, the target image is of height 460.A distance 440 marks the position of the lens diaphragm from the edge ofthe lens system 495. In embodiments which employ a converging lens, thelight may converge at a focal point R then travel out the other side ofthe lens system 495.

After leaving lens system 495, a beam of the light 455 is incident uponthe secondary reflective surface 401. The incident beam 455 hits thesurface 480 at point P_(i) and then is reflected off of the surface 401and travels as reflected beam 450 toward the sensor 405. Reflected beam450 forms an angle α_(i) relative to the light transmitting edge of lenssystem 495, and incident beam 455 forms an angle β_(i) relative to thelight transmitting edge of lens system 495. The angle of reflectionbetween incident beam 455 and reflected beam 450 is denoted by variableδ_(i).

The relationship between the aforementioned variables defined, in some2D embodiments, by the following equations:α=π−β−δβ=(π−γ_(H))/2δ=π−γ_(H)−2τ

The minimum Z-height 490 of the system 400 with folded optics isdetermined by the minimum back focal length. The minimum back focallength may be used to calculate a maximum value for the diameter 425 ofthe lens system. The diameter 425 of the lens system determines thevalue of the Z-distance to the sensor 420 and the value of theZ-distance to top of mirror 485. Adding together the values of theZ-distance to the sensor 420 and the Z-distance to top of mirror 485provides the minimum Z-height for the system 480.

In an embodiment, both the Z-distance to the sensor 420 and the distanceto the secondary reflective surface 430 are minimal, and thus theassembly 400 has the minimum back focal length that is required to usefolded optics. This may occur when the diameter of the lens system 425is increased to the point at which the reflected beam 450 just does notintersect with the lens system 495 and the sensor 405 just does notintersect with the lens system 495 and second reflective surface 401. Atthis point, the diameter of the lens system 425 also may have reachedits maximum value.

The minimum Z-height of the system 490 with folded optics is related tothe minimum back focal length, and from the minimum back focal lengththe maximum value for the diameter of lens system 425 may be calculated.The back focal length of the lens system 495 with folded optics may becalculated by adding the distance to the second reflective surface 401and the distance to sensor 415. In one embodiment, the field of viewγ_(H) may be fixed at 40 degrees, the height of the sensor 405 may be1.6 mm, and the sensor 405 may be a 1 Mpx sensor. The back focal lengthmay be 2 mm when the lens diameter 465 is 0.5 mm. In some embodiments,the number of sensors in a folded optic sensor array may be increased toachieve lower Z-heights.

In one embodiment, the sensor 405 may be a 5 MP sensor with 1.4 μm pixelpitch and the field of view γ_(H) may be 65 degrees. The effective focallength of this embodiment may be 3.57 mm when focused at infinity.Similarly, the effective focal length of an embodiment with an 8 MPsensor with a 1.12 μm pixel pitch may also be 3.57 mm, as the sensor canbe the same physical size as the 5 MP sensor. It is possible for theZ-height of the system 490 of theses embodiments to be around 3.9 mm.

FIGS. 5A and 5B illustrate two embodiments of six sensor folded opticarrays with corresponding fields of view. As discussed above withrespect to FIG. 4, the sensor assemblies of these embodiments may eachcomprise a sensor, lens system, and a reflective surface positioned toguide light onto the sensor. The central mirrors discussed in theseembodiments may be manufactured as an assembly of separate reflectivesurfaces or may be manufactured as a singular prism with multiplereflective surfaces.

FIG. 5A illustrates another embodiment of a folded optic sensor array500 with a first row of sensor assemblies 510, 520, and 530 and a secondrow of sensor assemblies 540, 550, and 560 around a central mirror 505.The sensor assemblies in each row may be rotated or tilted relative toone another, such that the sensors are not mounted in the same plane.For example, the outer sensor assemblies 510, 530 and 540, 560 may berotated plus or minus approximately 21 degrees with respect to thecenter sensors 520, 550. The central axes of the assemblies may be inone plane which is parallel to an image plane. Certain embodiments ofthe sensor assembly 500 may measure 11 mm×12 mm−4.5 mm (W×L−Z-height).Of course, embodiments are not limited to these rotations, and otherdegrees of rotation are contemplated.

Central mirror 505 may comprise six surfaces, each surface configured toredirect light comprising a portion of a target image scene toward oneof the sensor assemblies. For example, surface 570 may direct light atsensor assembly 540, surface 580 may direct light at sensor assembly550, and surface 590 may direct light at sensor assembly 560. In oneembodiment, surfaces 570 and 590 may be angled at 76×31.3 degrees(top×bottom) and surface 580 may be angled at 76.4 degrees×0 degrees(top×bottom). Although not visible in the perspective view of FIG. 5A,the side of central mirror 505 may comprise three additional surfacescorresponding to sensor assemblies 510, 520, and 530. One embodiment maycomprise a complex mirror with ten facets, six of which may bereflective surfaces. Some embodiments of the central mirror may comprisea complex mirror with six facets, and other embodiments may comprisethree separate wedge shaped mirrors. In other embodiments with Nsensors, the central mirror may comprise N surfaces, wherein each of theN surfaces is configured to direct light comprising a portion of atarget image scene toward one of the N sensors.

FIG. 5B illustrates another embodiment of a folded optic sensor array501 in which six sensor assemblies 511, 521, 531, 541, 551, and 561 aremounted around in a generally circular pattern around a cluster of threecentral mirrors 571, 581, and 591. In some embodiments, there may beapproximately a 76 degree angle between sensor assemblies 511 and 541and sensor assemblies 531 and 561. The sensor assemblies may be mountedin the same plane, for example on a substantially flat substrate. Insome embodiments, the sensors in the sensor assemblies may be arrangedperpendicular to the mounting surface. Each sensor may view a differentpart of the total field.

Central mirrors 571, 581, and 591 may also be mounted on the substrate.Central mirrors 571, 581, and 591 may each be a separate wedge-shapedmirror. Surface 571 may direct light at both sensor assemblies 511 and541. Surface 581 may comprise two separate reflective surfaces, a firstsurface which may direct light at sensor assembly 551 and a secondsurface which may direct light at sensor assembly 521. Surface 591 maydirect light at both sensor assemblies 531 and 561. Certain embodimentsof the sensor array 501 may measure 15 mm×17 mm−3.6 mm (W×L−Z-height).

In an embodiment, the sensors in the array 501 may be 5 megapixels witha 1.4 μm pixel size and 4:3 ratio, and having dimensions of 3.61×2.71 mm(W×H). In another embodiment, the sensors may be 8 megapixels with a1.12 μm pixel size and 4:3 ratio, and having dimensions of 3.66×2.74 mm(W×H). The field of view of each sensor may be 40 degrees. The overallsize of the array 501 in certain embodiments may be no larger than18×18−2.5 mm (W×L−Z-height). There may be a 5% to 10% overlap betweenthe fields of view of the various sensors at object distances greaterthan or equal to 20 cm. Angular overlap may be constant as function ofobject distance, or at least constant asymptotically.

Certain embodiments of the arrays 500, 501 may employ a similar lensassembly to the lens system 495 depicted in FIG. 4. All lens systems incertain embodiments of the array may have the same focal length, lensdiameter and length, which may yield desirable results with respect tomaximizing the usable sensor area. Maximizing usable sensor area mayalso be achieved by using different designs for the lens systems of theinner and outer sensors. In some embodiments, the lens diameter may beapproximately 1.3 mm, and the focal distance may be approximately 2.7mm. The maximum possible length of the lens system may be approximately2.3 mm, and the diameter (height) of the lens system may beapproximately 1.6 mm. The total field of view of the array 501 may be 83degrees.

FIG. 5C illustrates an embodiment of the projected fields of view of thefolded optic sensor array embodiments of FIGS. 5A-B. Although the sensorand central mirror configurations are different between the two arrayembodiments 500, 501, they share the same field of view configuration.Field of view 515 corresponds to sensors 510, 511; field of view 525corresponds to sensors 520, 521; field of view 535 corresponds tosensors 530, 531; field of view 545 corresponds to sensors 540, 541;field of view 555 corresponds to sensors 550, 551; and field of view 565corresponds to sensors 560, 561.

Fields of view 515 and 525 may share a triangular overlap where theangular overlap varies between 1-4 degrees in the X and Y-directions. Insome embodiments the overlap may be more than 4 degrees. For example insome embodiments the overlap may be 10 degrees or more in cases where itmay be appropriate as a design, based at least in part on the efficiencyof usage of sensor area and related loss. In some embodiments where theangular overlap is 3 degrees, at 1 meter fields of view 515 and 525 mayhave an overlap comprising 3.3% of the total captured area of the twooverlapping fields of view. Fields of view 525 and 535, fields of view545 and 555, and field of view 555 and 565 may also share a triangularoverlap of the same specifications. Further, fields of view 515 and 545may share a triangular overlap of 5.1% at 4 degrees. Fields of view 535and 565 share a similar overlap. Fields of view 525 and 555 overlap overthe sensor array 500, 501 and may share 3.3% at 3 degrees. The field ofview of the entire array 500, 501 may be 82 degrees. Some embodiments ofthe overlapping fields of view may be cropped to a rectangular 4:3aspect ratio 596, resulting in an 18.8% loss. Other embodiments may becropped to a 1:1 square aspect ratio 595, resulting in a loss of 11.3%.

In other embodiments, fields of view 515 and 525 may have an overlap of5.2 degrees comprising 6.7% of the total captured area of the twooverlapping fields of view. Fields of view 525 and 535, fields of view545 and 555, and field of view 555 and 565 may also share a triangularoverlap of the same specifications. Further, fields of view 515 and 545may share a triangular overlap of 8.5% at 4.9 degrees. As sown, fieldsof view 535 and 565 share a similar overlap. Fields of view 525 and 555overlap over the sensor array 500, 501 and may share 7.5% at 5.3degrees. Other embodiments may share larger or smaller percentages ofcaptured area at a variety of angles. Some embodiments of theoverlapping fields of view may be cropped to a rectangular 4:3 aspectratio 596, resulting in a 24.2% loss. Other embodiments may be croppedto a largest rectangle, resulting in a loss of 6.6%. The total field ofview may be 76 degrees. However, these numbers are based on visualoptimization of overlap areas, and vary dependent upon factors such asallowable loss area and object distance.

In one embodiment of sensor array 500, the center-center overlap (525,555) may be 5% at 3.7 degrees, the side-side overlap may be 5.1% at 4degrees, and the center-side overlap may be 3.3% at 3.3 degrees.Cropping at a 4:3 rectangular aspect ratio may result in an 18.8% loss,while cropping at the largest rectangle possible may result in an 11.3%loss. In one embodiment of sensor array 501, the center-center overlap(525, 555) may be 5% at 4.7 degrees, the side-side overlap may be 5% at4 degrees, and the center-side overlap may be 3.6% at 2.2 degrees.Cropping at a 4:3 rectangular aspect ratio may result in a 19.4% loss,while cropping at the largest rectangle possible may result in an 11.2%loss. In another embodiment of sensor array 501, the center-centeroverlap (525, 555) may be 2.4% at 1.6 degrees, the side-side overlap maybe 8% at 6.2 degrees, and the center-side overlap may be 6.9% at 4.3degrees. Cropping at a 4:3 rectangular aspect ratio may result in a14.2% loss, while cropping at the largest rectangle possible may resultin a 14.2% loss. The total field of view may be 83 degrees. In oneembodiment, the final image may be around 19 megapixels after 4:3cropping.

Limiting the total Z-height of the system may result in a portion ofeach sensor in the array becoming unusable due to the limited height ofeach secondary mirror. For example, in one embodiment of array 501employing sensor assemblies such as are described in FIG. 4, and inwhich the Z-height of the system is constrained to 2.5 mm, sensors 551and 521 may have a usable area of 54.2% and sensors 511, 531,541 and 561may have a usable area of 52.1%. The height of the usable sensor may bearound 2 mm under the height constraint for the system.

FIG. 6A illustrates another embodiment of a folded optic sensor array600. The sensor array 6600 with a first row of sensor assemblies 610,620, and 630 and a second row of sensor assemblies 640, 650, and 660around a central mirror 505. The sensor assemblies in each row may berotated or tilted relative to one another, such that the sensors are notmounted in the same plane. In some embodiments, such a sensorconfiguration provides a plurality of rectangular images, as the imageplane and focal plane may be parallel. Certain embodiments of the sensorarray 600 may measure 12 mm×15 mm−4.6 mm (W×L−Z-height).

Central mirror 670 may comprise six surfaces, each surface configured toredirect light comprising a portion of a target image scene toward oneof the sensor assemblies. Some embodiments of the central mirror maycomprise a complex mirror with six facets, and other embodiments maycomprise three separate wedge shaped mirrors. For example, surface 673may direct light at sensor assembly 640, surface 672 may direct light atsensor assembly 650, surface 671 may direct light at sensor assembly560, and surface 674 may direct light at sensor 630. Although notvisible in the perspective view of FIG. 6A, the opposite side of centralmirror 505 may comprise two additional surfaces corresponding to sensorassemblies 510 and 520. In other embodiments with N sensors, the centralmirror may comprise N surfaces, wherein each of the N surfaces isconfigured to direct light comprising a portion of a target image scenetoward one of the N sensors.

FIG. 6B illustrates an embodiment of projected fields of view of thefolded optic sensor array 600 of FIG. 6A. Field of view 615 correspondsto sensor 610, field of view 625 corresponds to sensor 620, field ofview 635 corresponds to sensor 630, field of view 645 corresponds tosensor 640, field of view 655 corresponds to sensor 650, and field ofview 665 corresponds to sensor 660.

Fields of view 615 and 625 may share a rectangular overlap that isconstant in the X- and Y-direction and constant asymptotically in theZ-direction. In some embodiments where the angular overlap is 1.8degrees, at 1 meter fields of view 615 and 625 may have an overlapcomprising 3.3% of the total captured area of the two overlapping fieldsof view. Fields of view 625 and 635, fields of view 645 and 655, andfields of view 655 and 665 may also share a rectangular overlap of thesame specifications. Center fields of view 625 and 655 may share arectangular overlap of 5.1% at 3.4 degrees. Side fields of view 615 and645, as well as 635 and 665, may share a rectangular overlap of 5% at3.6 degrees. Cropping to a rectangular 4:3 aspect ratio 680 may resultin a 15.6% loss, and cropping to a 1:1 square aspect ratio 690 mayresult in a 4% loss.

In another embodiment, the angular overlap between fields of view 615and 625 may be 3-5 degrees, and 1 meter fields of view 615 and 625 mayhave an overlap comprising 4%-6% of the total captured area of the twooverlapping fields of view. Fields of view 625 and 635, fields of view645 and 655, and fields of view 655 and 665 may also share a rectangularoverlap of the same specifications. Center fields of view 625 and 655may share a rectangular overlap of 6%-8% at 4-8 degrees. Side fields ofview 615 and 645, as well as 635 and 665, may share a rectangularoverlap of 6%-9% at 4-10 degrees. Cropping to a rectangular 4:3 aspectratio 680 may result in a 17.8% loss, and cropping to a largestrectangle may result in a 4.5% loss. The total field of view may bebetween 70 and 120 degrees. However, these numbers are based on visualoptimization of overlap areas, and vary dependent upon factors such asallowable loss area and object distance.

FIG. 7 illustrates another embodiment of a folded optic sensor array 700with a plurality of sensor assemblies 705 and a plurality of centralmirrors 710. As discussed above with respect to FIG. 4, each sensorassembly may comprise a sensor, a lens system, and a reflective surfaceconfigured to redirect light from the lens system onto the sensor. Inthis embodiment, a sensor array comprising two 3×1 arrays on either sideof a central mirror 710 has been repeated, such that there is a 2×2cascading array of the sensor arrays. Other embodiments may employ anysuitable cascaded array configuration

FIG. 8 illustrates another embodiment of a folded optic sensor assembly800. Essentially the mirrors are reversed in position as compared to theembodiments described above. For example, light comprising the targetimage is incident on two primary reflective surfaces 820, 821 whichsurround the sensor 810, 811. The light is redirected inward through twolens assemblies 840, 841 and then reflected off central secondaryreflective surfaces 830, 831 and down onto sensors 810, 811. Sensors810, 811 may represent individual sensors or an array of sensors.

FIG. 9 illustrates an embodiment of a folded optic image capture process900. The process 900 begins at step 905, in which a plurality of imagingsensor assemblies. This step includes any of the sensor arrayconfigurations discussed above with respect to the previous images. Thesensor assemblies may include, as discussed above with respect to FIG.4, a sensor, lens system, and a reflective surface positioned toredirect light from the lens system onto the sensor. The process 900then moves to step 910, in which at least one reflective surface ismounted proximate to the plurality of image sensors. For example, thisstep could comprise mounting a central mirror between two rows of sensorarrays, wherein the central mirror comprises a surface associated witheach sensor in the arrays.

The process 900 then transitions to step 915, in which light comprisinga target image of a scene is reflected off of the at least onereflective surface toward the imaging sensors. For example, a portion ofthe light may be reflected off of each of a plurality of surfaces towardeach of the plurality of sensors. This step may further comprise passingthe light through a lens assembly associated with each sensor, and mayalso include reflecting the light off of a second surface onto a sensor.Step 915 may further comprise focusing the light using the lens assemblyor through movement of any of the reflective surfaces.

The process 900 may then move to step 920, in which the sensors capturea plurality of images of the target image scene. For example, eachsensor may capture an image of a portion of the scene corresponding tothat sensor's field of view. Together, the fields of view of theplurality of sensors cover at least the target image in the objectspace.

The process 900 then may transition to step 925 in which an imagestitching method is performed to generate a single image from theplurality of images. In some embodiments, the image stitching module 240of FIG. 2 may perform this step. This may include known image stitchingtechniques. Further, any areas of overlap in the fields of view maygenerate overlap in the plurality of images, which may be used inaligning the images in the stitching process. For example, step 925 mayfurther include identifying common features in the overlapping area ofadjacent images and using the common features to align the images.

Next, the process 900 transitions to step 930 in which the stitchedimage is cropped to a specified aspect ratio, for example 4:3 or 1:1.Finally, the process ends after storing the cropped image at step 935.For example, the image may be stored in storage 210 of FIG. 2, or may bestored in working memory 205 of FIG. 2 for display as a preview image ofthe target scene.

Clarifications Regarding Terminology

Those having skill in the art will further appreciate that the variousillustrative logical blocks, modules, circuits, and process stepsdescribed in connection with the implementations disclosed herein may beimplemented as electronic hardware, computer software, or combinationsof both. To clearly illustrate this interchangeability of hardware andsoftware, various illustrative components, blocks, modules, circuits,and steps have been described above generally in terms of theirfunctionality. Whether such functionality is implemented as hardware orsoftware depends upon the particular application and design constraintsimposed on the overall system. Skilled artisans may implement thedescribed functionality in varying ways for each particular application,but such implementation decisions should not be interpreted as causing adeparture from the scope of the present invention. One skilled in theart will recognize that a portion, or a part, may comprise somethingless than, or equal to, a whole. For example, a portion of a collectionof pixels may refer to a sub-collection of those pixels.

The various illustrative logical blocks, modules, and circuits describedin connection with the implementations disclosed herein may beimplemented or performed with a general purpose processor, a digitalsignal processor (DSP), an application specific integrated circuit(ASIC), a field programmable gate array (FPGA) or other programmablelogic device, discrete gate or transistor logic, discrete hardwarecomponents, or any combination thereof designed to perform the functionsdescribed herein. A general purpose processor may be a microprocessor,but in the alternative, the processor may be any conventional processor,controller, microcontroller, or state machine. A processor may also beimplemented as a combination of computing devices, e.g., a combinationof a DSP and a microprocessor, a plurality of microprocessors, one ormore microprocessors in conjunction with a DSP core, or any other suchconfiguration.

The steps of a method or process described in connection with theimplementations disclosed herein may be embodied directly in hardware,in a software module executed by a processor, or in a combination of thetwo. A software module may reside in RAM memory, flash memory, ROMmemory, EPROM memory, EEPROM memory, registers, hard disk, a removabledisk, a CD-ROM, or any other form of non-transitory storage medium knownin the art. An exemplary computer-readable storage medium is coupled tothe processor such the processor can read information from, and writeinformation to, the computer-readable storage medium. In thealternative, the storage medium may be integral to the processor. Theprocessor and the storage medium may reside in an ASIC. The ASIC mayreside in a user terminal, camera, or other device. In the alternative,the processor and the storage medium may reside as discrete componentsin a user terminal, camera, or other device.

Headings are included herein for reference and to aid in locatingvarious sections. These headings are not intended to limit the scope ofthe concepts described with respect thereto. Such concepts may haveapplicability throughout the entire specification.

The previous description of the disclosed implementations is provided toenable any person skilled in the art to make or use the presentinvention. Various modifications to these implementations will bereadily apparent to those skilled in the art, and the generic principlesdefined herein may be applied to other implementations without departingfrom the spirit or scope of the invention. Thus, the present inventionis not intended to be limited to the implementations shown herein but isto be accorded the widest scope consistent with the principles and novelfeatures disclosed herein.

What is claimed is:
 1. An image capture system for capturing a targetimage of a scene, the system comprising: a plurality of image sensors,each of the plurality of image sensors having one of a plurality offields of view, each of the plurality of fields of view comprising asubstantially different portion of the scene; a plurality of lensassemblies, each lens assembly corresponding to one of the plurality ofimage sensors; at least one primary surface positioned so as to reflectlight comprising at least a portion of the scene through the pluralityof lens assemblies; a plurality of reflective secondary surfaces, eachof the plurality of lens assemblies positioned between the at least oneprimary surface and a corresponding one of the plurality of secondarysurfaces such that each of the plurality of secondary surfaces receivesat least a portion of the light from one of the plurality of lensassemblies and reflects the received light toward a corresponding one ofthe plurality of image sensors, and wherein each of the plurality ofimage sensors captures one of a plurality of partial images, each of theplurality of partial images corresponding to one of the plurality offields of view; and a processing module configured to assemble theplurality of partial images into the target image.
 2. The image capturesystem of claim 1, further comprising a substantially flat substrate,wherein the plurality of image sensors are positioned on thesubstantially flat substrate.
 3. The image capture system of claim 2,wherein the plurality of sensors are positioned laterally adjacent toone another on the substrate.
 4. The image capture system of claim 2,wherein the plurality of sensors are arranged in two rows on thesubstrate, and wherein the at least one primary surface is positionedbetween the two rows.
 5. The image capture system of claim 2, whereinthe plurality of sensors are arranged in a circular manner around theprimary surface on the substrate.
 6. The image capture system of claim1, wherein the at least one primary surface comprises a prism having atleast one surface configured to reflect the light.
 7. The image capturesystem of claim 6, wherein the prism comprises a plurality of facets,and wherein each of the plurality of facets reflects a portion of thelight comprising one of the plurality of fields of view toward one ofthe plurality of lens assemblies.
 8. The image capture system of claim1, wherein the at least one primary surface comprises a plurality ofprimary reflective surfaces, and wherein each of the plurality ofprimary reflective surfaces reflects a portion of the light comprisingone of the plurality of fields of view toward one of the plurality oflens assemblies.
 9. A method of capturing a target image of a scene, themethod comprising: providing plurality of image sensors, each of theplurality of image sensors having one of a plurality of fields of view,each of the plurality of fields of view comprising a substantiallydifferent portion of the scene; providing a plurality of lensassemblies, each lens assembly corresponding to one of the plurality ofimage sensors; reflecting light comprising at least a portion of thescene toward each of the plurality of lens assemblies using at least oneprimary surface; reflecting the light from each of the plurality of lensassemblies toward a corresponding one of the plurality of image sensorsusing a plurality of reflective secondary surfaces, the plurality ofsecondary surfaces each positioned between a corresponding one of theplurality of lens assemblies and the corresponding one of the pluralityof image sensors; capturing a plurality of partial images, wherein eachof the plurality of partial images is captured by one of the pluralityof image sensors and corresponds to one of the plurality of fields ofview; and assembling the plurality of partial images into the targetimage.
 10. The method of claim 9, wherein assembling the plurality ofpartial images comprises: combining the plurality of partial images intoa combination image; and cropping the combination image according to adesired aspect ratio to produce the target image.
 11. The method ofclaim 9, wherein assembling the plurality of partial images comprises:determining at least one area of overlap in the plurality of partialimages; and aligning the plurality of partial images based at least inpart on the at least one area of overlap, thereby generating an alignedimage comprising the scene.
 12. The method of claim 11, furthercomprising cropping the aligned image according to a desired aspectratio to produce the target image.
 13. The method of claim 9, furthercomprising focusing the plurality of partial images using the pluralityof lens assemblies.
 14. The method of claim 9, wherein directing lightcomprising at least a portion of the scene toward each of the pluralityof lens assemblies comprises reflecting the light using at least oneprimary reflective surface.
 15. The method of claim 14, whereinreflecting the light using at least one primary reflective surfacecomprises reflecting a portion of the light comprising one of theplurality of fields of view toward each of the plurality of lensassemblies using a plurality of primary reflective surfaces.
 16. Themethod of claim 9, wherein directing light comprising at least a portionof the scene toward each of the plurality of lens assemblies comprisesrefracting the light using at least one prism.
 17. The method of claim16, wherein refracting the light using at least one prism comprisesrefracting the light through a plurality of facets of the prism, whereina portion of the light comprising each one of the plurality of fields ofview is refracted through one of the plurality of facets toward one ofthe plurality of lens assemblies.
 18. A non-transitory computer readablemedium comprising instructions that when executed by a processor performa method comprising: capturing image data of a plurality of portions ofa target image scene using a plurality of image sensors, each of theplurality of image sensors having one of a plurality of substantiallydifferent fields of view determined by reflecting light comprising atleast a portion of the scene from at least one primary surface throughone of a plurality of lens assemblies and then reflecting said light offof one of a plurality of reflective secondary surfaces, and wherein eachof the plurality of portions of the target image corresponds to one ofthe plurality of fields of view; wherein the first field of view and thesecond field of view are determined at least in part based on at leastone surface configured to reflect or refract light comprising the scenetoward the first and second image sensors; and combining the pluralityof portions of the target image into the target image.
 19. An imagecapture system for capturing a target image of a scene, the systemcomprising: a central reflective component positioned to receive lightrepresenting the scene and reflect the light toward a plurality ofcameras; and the plurality of cameras, each of the plurality of camerascomprising: an image sensor configured to capture a portion of the lightrepresenting the scene, a lens assembly positioned to receive theportion of the light from the central reflective component, and anadditional reflective surface positioned between the lens assembly andthe image sensor such that the additional reflective surface receivesthe portion of the light from the lens assembly and reflects the portionof the light onto the image sensor.
 20. The image capture system ofclaim 19, wherein, for each of the plurality of cameras, the lensassembly is positioned between the central reflective component and theadditional reflective surface.
 21. The image capture system of claim 19,wherein the central reflective component comprises a plurality ofreflective surfaces, each of the plurality of reflective surfacespositioned to redirect a portion of the light toward a corresponding oneof the plurality of cameras.